JESD51-51 Implementation of the Electrical Test Method for the Measurement of Real Thermal Resistance and Impedance of Light-Emitting Diodes with Exposed Cooling
JESD51-51 发光二极管热阻抗电学测量方法

1、结温热阻：
热阻
Rθjx 器件的有效温度与外部规定参考点温度之差除以器件中的稳态功率耗散所得的商/单位：K/W
结温
Tj待测LED芯片有源区的温度/单位：K
K 系数
K系数是测试电流下待测LED正向电压的温度敏感系数的倒数/单位：K/mV

2、测量原理：
电压法测量LED器件结温热阻时，LED器件在小电流测试条件下正向压降VF与结温Tj变化成线性关系，斜率即为K 系数。

3、K系数标定

4、测量步骤
T/CSA 047-2019 Measurement Method for Real Thermal Resistance and Impedance of Light Emitting Diodes
T/CSA 047-2019 发光二极管热阻抗测试方法

参考标准：
JESD51, Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Devices).
JESD51-1, Integrated Circuit Thermal Measurement Method - Electrical Test Method.
JESD51-12, Guidelines for Reporting and Using Electronic Package Thermal Information.
JESD51-13, Glossary of Thermal Measurement Terms and Definitions.
JESD51-14, Transient Dual Interface Test Method for the Measurement of Thermal Resistance Junction- to-Case of Semiconductor Devices with Heat Flow through a Single Path.
JESD51-50, Overview of Methodologies for the Thermal Measurement of Single- and Multi-Chip, Single- and Multi-PN-Junction Light-Emitting Diodes (LEDs).
JESD51-52, Guidelines for Combining CIE 127-2007 Total Flux Measurements with Thermal Measurements of LEDs with Exposed Cooling Surface.
JESD51-53, Terms, Definitions and Units Glossary for LED Thermal Testing.
CIE S 017/E:2011 ILV, International Lighting Vocabulary.
CIE 127:2007 Technical Report, Measurement of LEDs, ISBN 978 3 901 906 58 9. MIL-STD-750D METHOD 3101.3, Thermal Impedance (Response) Testing of Diodes.
ANSI/IESNA IES Nomenclature Committee, IES RP-16-10, Nomenclature and Definitions of for Illuminating Engineering, ISBN 978-0-87995-208-2